eMMC and eSD Embedded Memories Combine Up To 32GB NAND and Controller in a Single Package
IRVINE, Calif., and TOKYO, August 7, 2008 — Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC)*, its subsidiary in the Americas, today announced the launch of 32GB1 embedded NAND flash memory devices that offer the largest density yet announced2 plus full compliance with the eMMC™ and eSD™ standards. The embedded devices are designed for application in digital consumer products, including mobile phones, video cameras, HDTV, personal navigation devices, POS terminals, printers, and set-top boxes. Samples will be available in September 2008, and mass production will start in the fourth quarter.
The new 32GB embedded devices combine eight 32Gbit (= 4GB) NAND chips fabricated with Toshiba's cutting-edge 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA Ver. 4.3 and SDA Ver. 2.0 high-speed memory standards for memory cards as defined by the MultiMediaCard Association and SD Card Association, respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.
Toshiba offers a line-up of single-package embedded NAND Flash memories which include a controller to manage basic control functions for NAND applications: LBA-NAND™ memory, which has a NAND interface; eSD large capacity chips with SD interface; and e MMC with an HS-MMC interface. This comprehensive line-up, available in densities ranging from 1GB to 32GB, supports applications in a very wide range of products.
There is growing demand for memories with a controller function that minimizes development requirements and eases integration into system designs. Toshiba has already taken steps to secure leadership in this expanding market, and the addition of higher density modules will reinforce the company's position.
Key Features
The integrated controller, compliant with JEDEC/MMCA Ver. 4.3 and SDA Ver. 2.0, handles essential functions, including writing block management, error correction (ECC) and driver software. It simplifies system development, allowing manufacturers to minimize development costs and to improve time to market for new and upgraded products.
A wide product line-up supports capacities from 1 to 32GB. The high-capacity 32GB device can record up to 560 hours of data at a bit rate of 128Kbps3 and can record4 hours of full spec high definition video and 7.3 hours of standard definition video 4.
The 32GB device stacks eight 32Gbit (=4GB) chips fabricated with leading-edge 43nm process technology.
SEM Photograph of 32GB device structure
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