SAN DIEGO, -- Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, wafer processing, and advanced assembly services announced today the appointment of Julie Adams as Worldwide Sales Director.
Ms. Adams is responsible for directing all sales activities and working with engineering and manufacturing staff to drive business development opportunities and to assure that customer requirements are met. She brings with her extensive experience in strategic sales and development of semiconductor packaging technologies and manufacturing equipment. She has held senior engineering positions at Motorola and Amkor and has spent several years in executive sales positions with RVSI Vanguard and most recently Royce Instruments. Ms. Adams also holds a BSME Degree from the University of Arizona. "We are excited to have Julie as part of our team," says Darby Davis, Delphon Director of Worldwide Sales & Marketing. "She has a long track-record of success in the semiconductor industry and we're confident that she will be successful in expanding Quik-Pak's worldwide sales efforts."
About Quik-Pak:
The company specializes in open-cavity plastic packages and assembly in 24 hours or less. A limitless array of open-cavity packages are available with no minimum quantity and can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing, die/wire bonding, laser micromachining, detector array processing, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.
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