Hynix Semiconductor's 41nm NAND flash has passed the validation process for Apple's iPhone 3GS amid recent reports that Micron Technology has also become a NAND flash supplier for the popular smartphone, according to industry sources.
Micron reportedly will kick off volume shipments of NAND flash chips using 34nm process to Apple in August.
Apple has recently inked a long-term supply agreement with Toshiba, prepaying half a billion US dollars for NAND chips.
According to iSuppli's teardown of the iPhone 3GS, Toshiba with its 16GB multilevel-cell (MLC) NAND flash costing US$24 scored the biggest single design-win in the smartphone. The research firm indicated that Apple may also source NAN D flash from others, most notably Samsung Electronics.
Samsung has reportedly begun sampling 35nm-made NAND flash chips with its controller IC design partners. The world's top NAND flash producer has delivered its 42nm parts, lagging Hynix' 41nm and Micron's 34nm processes.
Toshiba were cited in previous reports as saying mass production of its NAND chips fabricated with 32nm technology would start in second half of 2009.
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